中文信息-凯时尊龙官网

- 2016 - 2020：美国德克萨斯理工大学 （texas tech university），计算机科学（博士）

- 2014 - 2016：美国德克萨斯理工大学 （texas tech university），计算机科学（硕士）

• 2024.4 - 至今：  东南大学，集成电路学院，副教授

• 2024.1 - 2024.4：国家集成电路自动化设计技术创新中心，大模型项目组，项目主管

• 2023.6 - 2024.1：清华大学，深圳国际研究生院，项目研究员

• 2021.5 - 2023.5：清华大学，深圳国际研究生院，博士后研究员

• 2018.5 - 2018.8：美国西北太平洋国家实验室（pacific northwest national laboratory），high-performance computing department，博士实习（ph.d. intern）

• 2017.5 - 2017.8：美国阿贡国家实验室（argonne national laboratory），mathematics and computer science division ，科研助理（research aide）

• 2016.5 - 2016.8：美光科技（microntechnology, inc.），advanced memory system group，编译器工程师（compiler engineer）

研究专注于计算机体系结构，新一代eda工具，处理器设计，大语言模型，高性能计算，并行计算，编译器，二进制转译，敏捷开发工具链等方向。

近5年发表论文（ * 通讯作者）

• xi wang, gwok-waa wan, sam-zaak wong, layton zhang, tianyang liu, qi tian and jianmin ye, chatcpu: an agile cpu design & verification platform with llm, ieee dac 2024

• tianyang liu, qi tian, jianmin ye, liktung fu, shengchu su, junyan li, gwok-waa wan, layton zhang, sam-zaak wong, xi wang*, and jun yang，chatchisel: enabling agile hardware design with large language models，iseda 2024.

• yuxuan du, zhengguo shen, junyi qian, chengjun wu, weiwei shan, and xi wang*, dsc-trcp: dynamically self-calibrating tunable replica critical paths based timing monitoring for variation resilient circuits, ieee jssc, 2024. 

• cai li, haochang zhi, kaiyue yang, junyi qian, zhihao yan, lixuan zhu, chao chen, weiwei shan, and xi wang*, a 0.61μw fully-integrated keyword-spotting asic with real-point serial fft-based mfcc and temporal depthwise separable cnn, ieee jssc, 2023.

• xi wang, john d. leidel, brody williams, alan ehret, miguel mark, michel kinsy, and yong chen, xbgas: a global address space extension on risc-v for high performance computing, ieee conference on international parallel & distributed processing symposium (ipdps), best paper award (1/462), 2021. 

• xi wang*, antonino tumeo, john d. leidel, jie li and yong chen, ham: hotspot-aware manager for improving communications with 3d-stacked memory, ieee transactions on computers (tc). 

• zach hansen, brody williams, john d. leidel, xi wang, yong chen, dmm-gapbs: adapting the gap benchmark suite to a distributed memory model, ieee high performance extreme computing conference (hpec), 2021.

• brody williams, john d. leidel, xi wang, and yong chen, circustent: a benchmark suite for atomic memory operations, acm international symposium on memory systems (memsys), 2020.

• john d. leidel, xi wang*, brody williams, and yong chen, toward a microarchitecture for efficient execution of irregular applications, acm transactions on parallel computing (topc), 2020. 

• xi wang, john d. leidel, brody williams, and yong chen, pac: paged adaptive coalescer for 3d-stacked memory, acm high-performance parallel and distributed computing (hpdc), 2020. 

• xi wang, brody williams, john leidel, et al., remote atomic extension (rae) for scalable high performance computing. ieee design automation conference (dac), 2020. 

• xi wang, antonino tumeo, john d. leidel, jie li, and yong chen, mac: memory access coalescer for 3d-stacked memory, acm international conference on parallel processing (icpp), 2019. 

• jie li, xi wang, antonino tumeo, brody williams, john d. leidel, and yong chen, pims: a lightweight processing-in-memory accelerator for stencil computations, acm international symposium on memory systems (memsys), 2019.

• xi wang, john d. leidel, yong chen, memory coalescing for hybrid memory cube, acm international conference on parallel processing (icpp), 2018.

• csaw 2023 international ai hardware attack challenge, first prize

• ieee isscc 2023 “code-a-chip” award, first prize

• ieee conference on ipdps 2021 best paper award (1/462)

• best research poster award of nsf cac (cloud and autonomic computing) in 2020

• helen devitt jones excellence in graduate teaching award of texas tech university in 2018

• travel grant for attending acm/ieee sc17 (super computing 2017) in denver 2017

• travel grant for attending acm/ieee sc16 (super computing 2016) in salt lake city 2016

我们的团队名称为gear（ group of emerging architecture research），专注于计算机体系结构和eda方向的前沿探索，致力于推动全球新一代eda技术的发展，应对如今领域定制架构设计和日益繁复的系统设计挑战，以软硬协同的方式开展端到端的全栈式芯片设计研究。

every cog in the gear counts! & there is no loser in a winning team! 我们关注每一位团队成员的未来发展，以top-down的教育方式辅助全栈式的芯片设计流程学习，鼓励以兴趣为导向的开放研究模式。同时，我们也根据团队成员们的个人发展规划，平衡科研探索（research）和工程实现（development），致力于培养ic行业的六边形战士。

课题组常年招收研究生及本科生，欢迎对计算机体系结构、risc-v开源架构、cpu设计、eda工具链、大语言模型、人工智能、私密结算、编译器、高性能计算、二进制转换、和并行计算等方向感兴趣的同学加入，详情请通过邮件沟通咨询（xi.wang@seu.edu.cn）。